CMD-040N01 SFP+ Transceiver Modules | OSX040N01

CMD-040N01 | OSX040N01

COMMANDO 10GBASE-ER, SFP+, 1550nm, 40km, DOM, LC duplex, SMF, Compatible w/ Huawei OSX040N01

Features

  • CMD-040N01 SFP+ Transceiver Module
  • Cabling Type: 10GBASE-ER, SMF
  • Data Transfer Rate: 10Gbps
  • Connective Media: LC duplex
  • Distance Support: 40km
  • DOM Support: Yes
  • Form Factor: SFP (Small Form Factor Pluggable) MSA & ROHS Compliant

Small Form-Factor Plus Pluggable Transceiver

The enhanced small form-factor pluggable (SFP+) is an enhanced version of the SFP that supports data rates up to 16 Gbit/s.
Although the SFP+ standard does not include mention of 16G Fibre Channel it can be used at this speed.
SFP+ supports 8 Gbit/s Fibre Channel, 10 Gigabit Ethernet and Optical Transport Network standard OTU2. It is a popular industry format supported by many network component vendors.
10 Gbit/s SFP+ modules are exactly the same dimensions as regular SFPs, allowing the equipment manufacturer to re-use existing physical designs for 24 and 48-port switches and modular linecards.

Digital Optical Monitoring (DOM)

DOM, short for Digital optical monitoring, is familiar with the DDM function. It is also a feature which allows you to monitor many parameters of the transceiver module in real-time. DOM allows you to monitor the TX (transmit) and RX (receive) of the module, as well as input/output power, temperature, and voltage. Network administrators can then check and ensure that the module is functioning correctly

Product Details

Vendor Part Code OSX040N01 COMMANDO Part Code CMD-040N01
Form Type SFP+ Wavelength 1550nm
Interface LC duplex Cable Type SMF
TX Power -1~4dBm Commercial Temperature Range 0 to 70°C (32 to 158°F)
Max Data Rate 10Gbps Max Cable Distance 40km***
Optical Components EML 1550nm DOM Support Yes
Receiver Sensitivity < -16dBm HTS-Harmonized Code 8517706000

High Quality Components

High Quality Laser, IC and other Components

Advance Multi-Process for Manufacturing to ensure High Quality, Stable and Best Performing COMMANDO Products.

Manufacturing Process


  • Assembling: Component Assembling, Trim Pinning, Device Welding, Component Integration
  • Testing: Performance Testing, Parameter Adjustment, Final Setting
  • Aging: High Temperature, Aging (85℃)
  • Final Testing: Comprehensive Performance Testing, Final High and Low Temperature Measurement, Interface Testing, Transmission Testing, Appearance Inspection
  • Packaging: Information Accuracy, Labeling, Retail, Wholesale Packaging

Comprehensive Product Testing

Compatibility

Transmission distance

Band Calibration

Software/Coded Information

Microscopic Inspection

Box Packaging

Single Modules Packaging

10 Industrial Boxes(Default)

Carton Cartoon Packaging

Awards


Certification